Manufacturing Multilayer Pcb. Both sides of the core are covered with a uv sensitive dry film resist that is hot roll laminated in place. Special manufacturing setup and equipment are needed for 8 layer pcb manufacturing process.
At any given time 60 of our pcb manufacturing at omni is producing multilayer circuit boards so understanding the process is important. Multilayer pcb manufacturing process needs special precaution as there are more chances of cross connections overlaps tracing in copper areas etc. In fact the multilayer pcb manufacturing process requires an extremely high level of attention to detail especially since the heat and pressure of the manufacturing process should not impact any layer.
To produce a multi layer pcb alternating layers of epoxy infused fiberglass sheet called prepreg and conductive core materials are laminated together under high temperature and pressure using a hydraulic press.
The copper layer is pressed together by the resin layer prepreg. Due to the complexity of the multilayer pcb manufacturing process low production volume and difficulty in rework their prices are relatively higher than a single layer and double sided pcb. One of the more interesting activities routinely associated with pcb manufacturing is the process of assembling multilayer circuit boards. Layers of copper foil pre preg and core material are sandwiched together under high temperature and pressure to produce multilayer assemblies.
