Pyralux Ap. This material is ideal for multilayer flex and rigid flex applications that required advanced performance including low loss properties for excellent signal integrity and thermal resistance for high reliability. This material system is ideal for multilayer flex and rigid flex applications which require advanced material performance temperature resistance and high reliability.
This material is ideal for multilayer flex and rigid flex applications that required advanced performance including low loss properties for excellent signal integrity and thermal resistance for high reliability. Dupont pyralux ap is a double sided copper clad laminate featuring an adhesive less all polyimide dielectric layer. Pyralux ap pluslaminates feature a core construction of pyralux ap dielectric in extended thickness offerings of 7 12 mil 175 250 microns and greater.
Dupont is extending its portfolio of all polyimide copper clad laminates with pyralux ap plus building on its lead ing pyralux ap brand all polyimide copper clad laminate.
These clads provide designers and fabricators new options in building high reliability high yield circuits for controlled impedance and high frequency applications. These clads provide designers and fabricators new options in building high reliability high yield circuits for controlled impedance and high frequency applications. Dupont pyralux lf products are acrylic based copper clad laminates coverlays bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability. Pyralux ap copper clad laminate dupont pyralux ap is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal chemical and mechanical properties.
