Thin Film Circuits. Thin film ic interconnects carry relatively high current densities 10 5. The process of silvering was once commonly used to produce mirrors while more recently the metal layer is deposited using techniques such as spu.
High density lines and spaces as small as 5 microns. Multi layer circuits with up to six metal layers. Atp fabricates circuits on substrates using as fired alumina polished alumina aluminum nitride beryllium oxide fused silica quartz sapphire and hi k dielectrics.
Thin film technology uses semiconductor and microsystem technology processes to produce circuit boards on ceramic or organic materials.
We use our processing technology to fabricate circuits on as fired alumina polished alumina superstrate tps aluminum nitride beryllium oxide fused silica quartz sapphire and hi k dielectrics. The term thin film is derived from the fact that the deposited films are only a few microns aka micrometers in thickness and the films are usually applied to the substrate by sputtering. The metal deposition methods used in vacuum processes and the flexibility that can be achieved in terms of thickness and type of metallization in particular really set thin film technology apart from printed circuit board technology. High density lines and spaces as small as 5 microns.
